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The National Institute of Packaging, NIPHLE |
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2008 Scholarship Winners Curtis Conklin Curtis Conklin is a junior at Rochester Institute of Technology majoring in Packaging Science with a Minor in Economics. He has completed a co-op assignment with Zotos International, Inc., Geneva, NY as a Technical Packaging & Manufacturing Services Intern, and a co-op with S C Johnson & Son, Inc. in Racine, WI as a Research, Development & Engineering – Packaging Intern, 2007. Curtis was a winner of a National Institute of Packaging, Handling & Logistics Engineers Scholarship 2006, a recipient of the ISTA David LeButt Memorial Scholarship 2005/2006, winner of the Donald and Jeris Boyce Scholarship 2006. He is a member of NIPHLE, and the Institute of Packaging Professionals Connecticut Chapter, a member of the Golden Key International Honor Society (Top 15% of college students) and has been on the Dean’s List at RIT every quarter to date.Amanda Stempin |
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NIPHLE
177 Fairsom Court
Lewisburg, PA 17837-6844 570-523-6475 (Phone) 570-523-0606 (Fax) TOLL FREE 1-866-464-7453 |
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2007
2006
2005
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